Any LTCC specification benefit than FR4?
• Hi Q / Low loss, Precisely defined properties, Circuit density, Integral components, Functional trimming, Environmental stability, TCE match to Si/GaAs/SiGe, Thermal performance, Mixed Analog/Digital/RF, Integral Hermetic Packaging, Volume Manufacture • Low Temperature Co-fired Ceramic (LTCC) technology is a multi-layer ceramic process that can be used to fabricate low cost, high performance RF and microwave components. It is an extremely versatile technology that can be used to realize a wide range of components from simple passive filter structures and packages to complex sub-system assemblies containing discrete SMT (Surface Mount Technology) components, bare die and printed passives. This description of the LTCC process makes it sound similar to conventional multi-layer circuit boards fabricated using laminate materials such as FR4. However, LTCC has a number of advantages: ELower loss dielectric (lower tan_) EBetter controlled dielectric properties (`r, tan_ and thickness) E It
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