Are lead-free NXP devices compatible with conventional (Sn/Pb solderpaste) soldering processes?
Yes. For many years our products have been suitable for the higher temperature profiles required by most lead-free soldering processes. Full forward / backward compatibility (exception is the BGA-family as conventional reflow temperatures are too low for melting SAC solderball) is ensured because all lead-free devices have either pure tin or NiPdAu plating. As with any change it may be necessary to re-optimize the soldering processes. As with any change it may be necessary to re-optimize the soldering processes.
