Are LSI lead-free products RoHS Compliant?
Yes. All versions of LSI lead-free IC products are RoHS compliant. In the case of leadframes and ball grid arrays (BGAs), these lead-free products are manufactured without lead in the interconnects unless authorized by an exemption in the Annex to the EU RoHS Directive. Additionally, all LSI IC products (both lead-containing and lead-free) do not contain cadmium, hexavalent chromium, mercury, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). LSI’s Flip-Chip BGA packages currently qualify for an exemption from under the EU RoHS Directive. Under this exemption, first level interconnect solder bumps between the semiconductor die and carrier within flip-chip package types can continue to contain lead and still be considered RoHS compliant. The second level solder bumps on the exterior of the package are lead-free. LSI does offer a completely lead-free Flip-Chip package option. LSI also offers Storage Products which are RoHS Compliant.