Can standard tin-lead components be assembled under lead-free reflow conditions?
LSI recommends reflowing components with the appropriate reflow temperature guidelines defined by J-STD-020C or J-STD-02D. It is not recommended to mix lead-free packages with standard tin-lead assembly conditions (backward compatibility) or vice versa. More information can be found in LSI’s Board Assembly Application Guidelines for Leadframe and BGA Components.
Related Questions
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