Can the current limits for metal interconnect in the design rules be exceeded if the design is only a proof of concept prototype?
Current density limits, specified in the design rules, are defined by foundries to provide reasonable assurance that metal interconnects will not fail because of electromigration within about twenty years. Modest current density overstress will certainly shorten interconnect lifetimes, but the lifetime versus current density tradeoffs involve knowledge about electromigration model parameters that are considered proprietary by foundries. Designers must conform to design rules in order to have reasonable assurance of a reliable design. More information about electromigration will be found in a short tutorial on Reliability in CMOS IC Design. 14.0 If I have several smaller circuits, can I put them together to make up the 10 mm² minimum charge? Can I have sawstreets dividing my cells into sizes smaller than 10 mm² as long as the total area is 10 mm²? Third Party Services. Contact the assembly vendor to confirm their sawstreet requirements and die thickness. –> Yielding to incremental cost
