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Has Testing Been Done to Qualify Diodes, Inc.’s Lead Free Finishes for Use in Standard SMT/Through-Hole Assembly Processes?

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Has Testing Been Done to Qualify Diodes, Inc.’s Lead Free Finishes for Use in Standard SMT/Through-Hole Assembly Processes?

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Each product family where the Lead Finish is being converted to Pb Free has been or will be re-qualified by subjecting a family sample to the following tests (typical): Preconditioning (PC) followed by: Highly Accelerated Stress Testing (HAST) Autoclave (AC) Temperature Cycling (TC) Solderability With SnCuAg Solder With SnPb Solder Resistance to Solder Heat (RSH)

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