Has Testing Been Done to Qualify Diodes, Inc.’s Lead Free Finishes for Use in Standard SMT/Through-Hole Assembly Processes?
Each product family where the Lead Finish is being converted to Pb Free has been or will be re-qualified by subjecting a family sample to the following tests (typical): Preconditioning (PC) followed by: Highly Accelerated Stress Testing (HAST) Autoclave (AC) Temperature Cycling (TC) Solderability With SnCuAg Solder With SnPb Solder Resistance to Solder Heat (RSH)
Related Questions
- Has Testing Been Done to Qualify Diodes Incorporateds Lead Free Finishes for Use in Standard SMT/Through-Hole Assembly Processes?
- Has Testing Been Done to Qualify Diodes, Inc.’s Lead Free Finishes for Use in Standard SMT/Through-Hole Assembly Processes?
- What is the typical lead time for reels of standard SMT parts?