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has the soldering process changed due to moving to Lead Free (gold flash) terminals?

April 26, 2017changed Flash Free gold lead moving process soldering terminals

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has the soldering process changed due to moving to Lead Free (gold flash) terminals?

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The gold flash plating is backward and forward compatible. Backward means soldered with tin lead and forward with pure tin soldering process. Between the 2 processes there can be a difference in temperature of 20 to 30C and 10 to 30 seconds. Gold flash plating withstands all the different curves, which is a big advantage compared to tin/lead or pure tin. This also means that you can use your pure tin or tin/lead soldering process for CMM connectors, the choice being dependant more on the other components of the board and the decision to have a total RoHS compliant product.