How can I obtain layer thickness information for MOSIS wafers?
Layer thickness information is normally included in a wafer fabricator’s process specifications. These can be obtained by following the instructions in Section 2 above. 4. Can I obtain information like doping levels for a particular process? Fabricators do not provide this type of information about their processes. 5. Which MOSIS processes support MEMS fabrication? Currently, it is only possible to construct MEMS devices in MOSIS technologies which have minimum feature sizes greater than 1.0 µm. This restriction exists because the submicrometer technology design rules prohibit using oversize contacts and vias. Also, most of the submicrometer technologies use silicided active area, which is not compatible with MEMS structure release etch chemistry. For more information, see MEMS Available through MOSIS.