If the solder mask is damaged or missing in the area of the board where the StencilQuik™ stencil will be applied, do I have to repair the mask underneath the part?
When utilizing StencilQuik™ to effect solder mask repairs, care should be taken to ensure that the StencilQuik™ apertures diameter are not too large and leave areas of the vias exposed. If portions of the vias are exposed it will allow the solder to “wick” down the vias from the pads. It is recommended that the aperture size is only slightly greater than the ball diameter. This will allow the solder to properly flow and wet while preventing exposed vias.
Related Questions
- Do I need to mask off the areas surrounding the StencilQuik™ stencil while I am applying the solder paste, and if I do, what is the best material and method for that?
- Should I change the design of my StencilQuik™ stencil if the board I am using has solder mask defined pads instead of non-solder mask defined pads?
- How will a StencilQuik™ stencil be affected by placement on a warped area of the board?
