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In what way does a lead-free thermal profile differ from a traditional tin-lead process?

April 26, 2017differ Lead-Free process profile Thermal tin-lead traditional

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In what way does a lead-free thermal profile differ from a traditional tin-lead process?

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The main difference when using tin-silver-copper as the paste alloy will be the peak temperature. This alloy melts between 217-221 C; peak temperature will be between 230-255 C depending on the thermal mass of the assembly. It is recommended that the time above liquidus (TAL), be under 90 seconds to avoid charring of the residues; this will also reduce the incidence of intermetallics.