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Is the implementation of EBG structures into printed circuit boards something that can be done with standard PCB design and assembly processes, or would a new tool set need to be developed?

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Is the implementation of EBG structures into printed circuit boards something that can be done with standard PCB design and assembly processes, or would a new tool set need to be developed?

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Since WEMTEC EBG structures may be implemented as planar printed structures using conventional cores and metal layers, then standard layout tools such as those offered by Cadence or Mentor Graphics may be used for patch and via layout. Layout can be done for organic printed circuit boards, multilayer ceramic modules, or even silicon wafers. However, the design and validation of an EBG structure to satisfy certain frequency goals will require a more specialized tools set. An initial design may be created using effective medium models found in proprietary Mathcad codes developed by WEMTEC. These codes implement fast analytic methods. However, any EBG structure should be modeled in detail using a full-wave electromagnetic simulator prior to fabrication. WEMTEC uses Microstripes, a time domain transmission line matrix code, but other tools such as HFSS from Ansoft, or Microwave Studio from CST will also work well for validation. • Q: How do power integrity engineers measure the merit of a

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