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What approach was used for board-level testing and what tests were run?

April 26, 2017approach board-level run Testing tests Used

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What approach was used for board-level testing and what tests were run?

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• A variety of surface mount packages were selected to cover small and large body sizes, gull-wing and J-bend lead geometries as well as land area contacts. • Lead-free parts were attached to the PCB using both SnPb and Sn3.5Ag0.7Cu pastes. • PCBs with both NiAu and Cu/OSP finishes were evaluated. • Board-level temperature cycle was run at –40/125° C for 1050 cycles. • Drop and vibration tests were run for the LLP package only.