What contributes to the thermal resistance of a package?
Thermal resistance of a package can be defined as the heat dissipation capability of a package. The rate of heat dissipation in a package is affected by the thermal conductivity of each component: chip, die-attach adhesive, substrate, and mold compound. Heat flow is dependent on the thermal conductivity of each component and the overall package geometry. Thermal resistance at interfaces (example: adhesive to die) is also critical to overall heat dissipation of the package.
