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What fabrication processes are available?

April 26, 2017fabrication Processes

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What fabrication processes are available?

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MOSIS offers several CMOS processes, with feature sizes from 1.5 microns to 65 nanometers. For more information, see Fabrication Processes Available Through MOSIS. 3.0 What packaging technologies are available? Customers can order packaged and/or unpackaged parts. Supported packages include (a) MOSIS-provided ceramic packages, (b) MOSIS-provided i2a Technologies (formerly IPAC), and open cavity plastic packages and (c) customer-supplied packages assembled by MOSIS vendors. MOSIS also supports flip-chip bumping. 4.0 Can I order the following from MOSIS? 4.1 Can I order Design Services? MOSIS does not currently provide design services. Third-party providers provide a variety of services. 4.2 Can I order Testing Services? Functional testing (digital) is available from MOSIS. Contact the MOSIS support desk for more details. 4.3 Can I order Design Rule Checking? MOSIS does offer an optional design rule checking service. For more information, see MOSIS Design Rule Checking Service. 4.4 Can I