What future developments are likely for CompactPCI?
As of April 1996, several technical subcommittees have been formed to expand the definition of the bus. They include: Hot Swap CompactPCI Bridging (more than 8 slots) – Recommended Practices VME-64 Extension (allows the construction of hybrid CompactPCI/VME systems) TDM (Computer Telephony) Buses on P2 (including MVIP and SCSA) Also, a “Pin Registry” is being developed to detail recommended practices for using the upper three connectors on 6U boards for I/O. For example, PICMG has developed recommended practiced for IndustryPack and PMC pinouts on the additional connectors.
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