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What is the recommended dispense location for unfilling flip chips?

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What is the recommended dispense location for unfilling flip chips?

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For the simplest bump layouts (full array or staggered full array) the dispense location is arbitrary. With rectangular die dispensing along the longest edge is recommended. The dispense location for mixed or unique bump layout will depend on the bump layout. Depopulated areas (no bumps), such as center area for peripheral bump layouts are more prone to voids.

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