What materials can be deposited by the available thin film deposition techniques?
A broad range of metals and alloys can be evaporated from our Edwards thermal (Auto 306) or electron beam (FL 400) coaters. Si3N4 and SiO2 dielectric films can be formed by plasma-enhanced chemical vapour deposition (Plasma Therm 790 – PECVD). SiO2, Al, Ti and various other oxides or metals can be deposited in our dual ion beam sputtering unit (Nordiko 3000 / M DBIS).