Which MOSIS processes support MEMS fabrication?
Currently, it is only possible to construct MEMS devices in MOSIS technologies which have minimum feature sizes greater than 1.0 µm. This restriction exists because the submicrometer technology design rules prohibit using oversize contacts and vias. Also, most of the submicrometer technologies use silicided active area, which is not compatible with MEMS structure release etch chemistry. For more information, see MEMS Available through MOSIS.
