Which Spansion products meet the definition of low halogen?
By our own definition above, all of Spansion’s current leadframe products (PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP packages) are low halogen. Some of the Fujitsu legacy parts are not. FBGA, and MCP packages normally do not meet the definition of “low halogen” due to the presence of brominated epoxy resins in substrates of Mitsubishi Gas Chemical CCL-HL 832HS. Spansion expects to qualify low halogen FBGA and MCP packages for production beginning in Q3 2008. These substrates will use Mitsubishi Gas Chemical CCL-HL 832HX type A. We expect these substrates to be of interest primarily to our wireless customers. The original substrate material will remain in production. Please note our definition for low halogen does not include fluorine. Substrate products may use a small amount of fluoropolymers in die attach film. For more information see the individual package MDDS, which is posted in the packaging handbook on Spansion’s website.
