Why are larger wafers considered to be better?
Because hundreds of microprocessors are built on a single silicon wafer, larger wafers create cost savings. Simply, more chips can be produced per wafer at one time. Intel now manufacturers its most advanced microprocessors and chipsets on 300 mm wafers, which are approximately 12 inches in diameter. Because a 300mm wafer has more surface area, it is possible to put up to two and a half times more individual chips (called die) on a wafer than with an equivalent 200mm wafer. Capital cost typically is only about one and a half times greater so it is possible to recover the increased capital investment rapidly. Greater output per wafer means efficiency gains in the use of energy, materials and other resources. Production cost per die drops by more than 30% compared to a similar product and process on 200mm wafers.
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