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Why do Spansion Cu leadframe products use matte Sn in spite of concerns regarding whisker growth?

April 26, 2017concerns CU leadframe matte products SN Spansion spite whisker

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Why do Spansion Cu leadframe products use matte Sn in spite of concerns regarding whisker growth?

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Matte Sn plating has been chosen for Cu leadframe Spansion Non-Pb memory products for the following reasons: • Matte Sn is compatible with existing SnPb and Non-Pb board assembly processes. • Matte Sn has a higher melting point than other Non-Pb alternatives, which makes it acceptable for automotive and high temperature applications. To date, no whisker growth has been observed for the matte Sn plating chemistry qualified for Spansion memory products. Refer to the linked 100% Sn Whisker Growth Study for further details.