Since Q1 2005, Spansion marks second level packaging (inner cartons, dry pack bags, and so forth) with the following symbol: In Q2 2007, Spansion added the following symbol: RoHS Since Spansion does not sell product to consumers, packaging is not ... more

Yes. Spansion Flash memory products with Non-Pb solder finishes contain less than regulated concentrations of Cadmium (Cd), Mercury (Hg), Hexavalent Chromium (Cr6+), Lead (Pb) [as detailed under FAQ #1], PolyBrominated Biphenyls (PBB), and ... more

By backward compatibility, we mean to indicate whether a Spansion Non-Pb product is capable of being processed using a SnPb solder process and reflow temperature profile. By forward compatibility, we mean to indicate whether the SnPb product is ... more

All Spansion products are available with Non-Pb solder finishes. Parts with Non-Pb solder finishes and parts with SnPb (Tin-Lead) solder finishes are differentiated by the part number. More information is available under FAQ #14. ... more

Changes to solder paste, type of flux and reflow profile may be required to achieve optimal quality and reliability solder joints. Check with your paste/flux provider for processes/profiles based on your specific application. ... more

Note: Information regarding OPNs for legacy products is informational only, not all legacy products will be available with Non-Pb solder finishes. Spansion OPNs use the 13th digit of the OPN to differentiate between SnPb and Non-Pb solder finishes. ... more

Spansion Non-Pb parts are backward compatible. However, in some cases, minor adjustments in the peak reflow temperature may be required to obtain good quality solder joints. Spansion Non-Pb leadframe based packages can be considered as "drop-in ... more

Cu (Copper) leadframe packages including: PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP; use 100% matte-Sn (Tin) plating. Laminate packages including both single-die FBGAs and multi-die MCPs use solder spheres composed of SAC 305 (96.5% weight Tin, 3.0% ... more