Does the die need preparation, e.g. chip metallization or polishing?
Simply a bare die is preferable for our system, since the PCMA can wet the silicon directly. Also, no special polishing is required. The more flat and polished the surfaces are, however, the thinner the BLT can be made. With any interfacial heat transfer situation, a smooth flat surface will enhance performance, but not in excess of that which is typical of Indigo.
