How are spot cure products cured?
Spot cured products eliminate the need for offline cure equipment since partial curing is done on the die bonder in an in-line heated process after die attach. Adhesion strength achieved during partial cure must be high enough to prevent die movement during subsequent processes such as wire bonding and molding. Full cure takes place during the mold process. Spot cured products typically are partially cured at temperatures as low as 150°C for 10 seconds. For specific spot cure recommendations refer to the product technical data sheet. Low outgassing is typically required since it must be able to spot cure without voiding.
