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Is VeloceRF applicable to system-in-package (SiP)?

April 26, 2017applicable SIP velocerf

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Is VeloceRF applicable to system-in-package (SiP)?

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Yes, VeloceRF’s inductive modeling approach is applicable to multi-layer laminate package substrates, such as LTCC. Contact us to learn more about the VeloceRF SiP add-on, which models SiP modules comprising flip-chip die over a multi-layer laminate. VeloceRF enables the integration of high quality inductors and passive circuitry within the package, and also models the electromagnetic interactions between on-chip and in-package inductive structures.