What are the major benefits of C4NP compared to the placement of preformed solder spheres?
2. C4NP efficiently matches deposited volume to final bump volumes, thus avoiding solder waste. Evaporation is notoriously wasteful, with 98-99% of the solder volume wasted during each evaporative cycle, with negative cost and environmental impact. 1. C4NP achieves much finer bump sizes and pitches than solder printing. C4NP dispenses pure molten alloy with essentially no volume change between the as-deposited and final bump solder volumes, whereas printing deposits solder paste which when reflowed to solder reduces to about 50% of the paste volume. 2. Solder printing is prone to large voids in the final solder bumps due to the coalescing of individual solder particles within the paste during reflow. C4NP remains pure molten solder from deposition through final bump formation.
