What are the major differences between the Ultra CSPTM package and FCIs standard flip chip package?
FCI’s standard flip chip “Flex on Cap” (FOC) technology process offers very fine pitch capability, i.e. below 200 micron pitch even on full area arrays. This fine pitch bumping utilizes ~100 micron solder balls which require underfill in final assembly. The Ultra CSPTM technology is offered in standard CSP pitches ranging from .50mm to 1.0mm. This larger pitch allows the use of larger solder balls which provide sufficient solder volume/standoff such that underfill is NOT required for final board assembly.
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