Why is the total thermal resistance reduced between thermally linked heat sources and heat sinks through soft silicone interface materials, even though they are placed far from each others ?
Since soft-silicone interface materials are very compressible as well as compliant, with a thickness of 0,5 mm and more, they are able to thermally connect in the best possible way components which are far from each others or/and of different sizes. The contact surfaces can be ideally reached and even the sides of the components can be partly covered, cushionwise. As a result, the total contact surface becomes larger. The thermal contact resistance and therefore the total resistance can be minimized.
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